EMI shielding for electronic component packaging
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United States of America Patent
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Sep 19, 2006
Grant Date -
Nov 25, 2004
app pub date -
Apr 15, 2004
filing date -
Apr 15, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.
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