Reworkable compositions incorporating episulfide resins
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United States of America Patent
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Sep 19, 2006
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app pub date -
Sep 15, 2000
filing date -
Sep 15, 2000
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Abstract
This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays ('LGAs'), and the like, each of which having a semiconductor chip, such as large scale integration ('LSI'), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.
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