Plating apparatus and plating method
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United States of America Patent
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Sep 19, 2006
Grant Date -
Apr 17, 2003
app pub date -
Oct 8, 2002
filing date -
Oct 11, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In the invention, there is provided a plating treatment technique which permits uniform plating treatment and easy replacement of articles to be plated without the effect of bubbles in a plating solution by improving wet plating apparatuses of the contact type to thereby solve problems such as the removal of bubbles in a plating solution and the removal of an adhering plating solution. Provided is a plating apparatus having a plating tank, which comprises: an opening which has a solution seal to prevent a plating solution from leaking when an article to be plated is placed on the opening; a solution-supply portion which supplies the plating solution; a solution-discharge portion which discharges the plating solution; and an anode which is opposed to the article to be plated that is placed, wherein the plating tank has rotational means for rotating the plating tank itself.
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