Exposure system and method for manufacturing device
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United States of America Patent
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Sep 12, 2006
Issued Date -
N/A
app pub date -
Oct 22, 2004
filing date -
Apr 24, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An exposure system is provided which can maintain a predetermined performance of the exposure apparatus stably by maintaining a cooling capacity by preventing a negative pressure from being generated in a circulation path of the liquid and preventing the back pressure from increasing even if at least a part of a temperature adjusting device is disposed under a disposition surface of the exposure apparatus due to the disposition area. A sealed tank which stores the cooling agent which is circulated in the circuiting systems and a pump, etc., which circulates the cooling agent are disposed under the disposition surface FL of the exposure system. The reticle stage and the wafer stage which are objects of which the temperature is supposed to be controlled are disposed above the disposition surface FL. A tank which open to air is provided so as to prevent the negative pressure from being generated in the reticle stage, etc. such that the tank and the tank are connected by a connecting piping arrangement. Also, the piping arrangement which eliminates the bubbles which are contained in the cooling agent which is circulated in the circulating systems are connected to the circulating systems.
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