Multiple cavity/compartment package
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United States of America Patent
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Sep 5, 2006
Issued Date -
N/A
app pub date -
Aug 19, 2004
filing date -
Aug 19, 2003
priority date (Note) -
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Abstract
A package assembly for electronic components that allows for low-cost multiple cavities as well as a multiple compartment structure that allows more components in a smaller package size. In one embodiment the present invention is a multi-cavity package having at least one substrate forming at least one cavity with the substrate coupled to a shelf within the sidewalls of the package.
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