Photosensitive resin compositions

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United States of America Patent

PATENT NO 7101652
APP PUB NO 20040249110A1
SERIAL NO

10796587

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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New photosensitive PBO precursor polymers which contain diazoquinone moieties attached to its backbone and in which all amino end groups are converted into amide groups. The photosensitive formulation based on the disclosed PBO precursor polymers have good imaging and mechanical properties as well as superior shelf life stability.Photosensitive polybenzoxazole precursor polymers having (sulfon)amide end groups (with or without attached diazoquinone groups) can be formulated into photosensitive compositions with diazoquinone photoactive compounds which lack benzylic hydrogens on the backbone to yield compositions producing films significantly lighter in color after curing.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM ELECTRONIC MATERIALS U S A INC80 CIRCUIT DRIVE NORTH KINGSTOWN RI 02852

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hopla, Richard Cranston, RI 12 120
Naiini, Ahmad A East Greenwich, RI 36 254
Racicot, Donald Providence, RI 2 14
Rushkin, Ilya Walpole, MA 10 117

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