Ceramic package and chip resistor, and methods for production of the same
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United States of America Patent
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Aug 29, 2006
Grant Date -
Apr 21, 2005
app pub date -
Nov 19, 2003
filing date -
Nov 25, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A ceramic package and a chip resistor obtained by forming, on a plastic ceramic green sheet comprising 100 parts by weight of a ceramic powder mainly composed of borosilicate glass, into which 10 to 30 parts by weight of an acrylic copolymer obtained by polymerizing 100 parts by weight of a (meth)acrylic acid ester and 1 to 10 parts by weight of a monomer having a functional group of a hydroxyl group, acid amide group, or amino group and having a Tg in the range of -30.degree. C. to +10.degree. C. is compounded, a conductor layer using a plastic conductive paste obtained by compounding, into 100 parts by weight of a conductive powder, 5 to 20 parts a mixture of an acrylic copolymer having a Tg of not more than -30.degree. C. and an ethylcellulose-based binder, press forming the resultant single layer of ceramic green sheet, and calcining the resultant ceramic green sheet having the integrally formed bottom, opening and opening circumferential edge and a method for producing the same.
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