Method of manufacturing a microcomponent assembly
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United States of America Patent
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Aug 29, 2006
Grant Date -
N/A
app pub date -
Jul 10, 2003
filing date -
Jul 10, 2003
priority date (Note) -
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Abstract
A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.
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