Polymer based tunneling sensor
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United States of America Patent
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Aug 22, 2006
Grant Date -
N/A
app pub date -
Aug 27, 2003
filing date -
Aug 27, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for fabricating a polymer based circuit by the following steps. A mold of a design is formed through a lithography process. The design is transferred to a polymer substrate through a hot embossing process. A metal layer is then deposited over at least part of said design and at least one electrical lead is connected to said metal layer.
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