Semiconductor device
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United States of America Patent
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Aug 15, 2006
Grant Date -
Oct 14, 2004
app pub date -
Apr 9, 2004
filing date -
Apr 11, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An electrode on a main surface of a module board, to which an emitter electrode of a semiconductor chip which includes a switching element of a power supply control circuit that supplies a power supply voltage to amplifier circuit parts of a power module of a digital cellular phone, is electrically connected to a wiring in an internal layer of the module board through a plurality of via holes. Further, the wiring is electrically connected to an electrode for the supply of the power supply voltage, which is provided on a back surface of the module board. Accordingly, an output characteristic of the semiconductor device is improved.
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