Sputtering device
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United States of America Patent
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Aug 15, 2006
Grant Date -
May 13, 2004
app pub date -
Dec 31, 2002
filing date -
Nov 8, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
An object of the invention is to provide a method of sputtering and a device for sputtering which can improve distribution of a film's thickness and coverage distribution improve. The device for sputtering includes at least a substrate, a substrate holder which holds the substrate, a target for forming a thin film on the substrate, a sputtering cathode in which the target is installed, a means for sputtering which makes materials of the target sputter to the substrate. Sputtering is carried out by making the substrate holder rotate and making a sputter cathode unit comprising at least one sputtering cathode move along an arc over the rotating substrate held on the substrate holder.
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