Encapsulation of polymer based solid state devices with inorganic materials
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United States of America Patent
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Aug 8, 2006
Grant Date -
Jul 22, 2004
app pub date -
Jan 6, 2004
filing date -
Aug 3, 1998
priority date (Note) -
Expired
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Abstract
Methods for creating a protective seal suitable for protecting polymer-based electronic devices, including light emitting diodes and polymer emissive displays, are disclosed together with the protected devices. The protective seal includes one or more thin films of silicon nitride (SiN) or other inorganic dielectric applied at low temperature. One or more nonreactive metal layers may be present in the protective layer as well. Other embodiments are disclosed which include a protective cover over the protective layers. These protective layers provide encapsulation with sufficient protection from the atmosphere to enable shelf life and stress life for polymer electronic devices that are adequate for commercial applications.
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