Method for forming plating film
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United States of America Patent
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Aug 8, 2006
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N/A
app pub date -
Sep 21, 2004
filing date -
Jun 27, 2001
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Abstract
A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
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