Polymer compound, precursor for the same and thin film-forming method using the same polymer precursor
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United States of America Patent
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Aug 8, 2006
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N/A
app pub date -
Aug 18, 2005
filing date -
Dec 26, 2001
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Abstract
Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): ##STR00001## (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): ##STR00002## (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R.sub.1 and R.sub.2 each represent independently an alkyl group having 1 to 5 carbon atoms).
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