Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
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United States of America Patent
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Aug 1, 2006
Grant Date -
Mar 17, 2005
app pub date -
Sep 30, 2004
filing date -
Sep 5, 1996
priority date (Note) -
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Abstract
A semiconductor device connecting structure is provided for connecting a semiconductor IC to a substrate. A bonding layer is placed between the substrate and the semiconductor IC to accomplish adhesion therebetween. Sufficient heat and pressure are applied to the bonding layer to create spaces therein which deform during relative movement between the semiconductor IC and substrate thereby maintaining consistent electrical contact between the semiconductor contact bumps and electrodes on the substrate.
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