SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power
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United States of America Patent
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Jul 25, 2006
Grant Date -
Apr 13, 2006
app pub date -
Mar 14, 2005
filing date -
Oct 8, 2004
priority date (Note) -
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Abstract
A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external heat sink so as to achieve better heat dissipation. The slot is used for accommodating a LED chip that is electrically connected with a circuitry extension device through two electrical contacts. The LED chip is electrically connected with the circuitry extension device directly while it also connects with the base for heat dissipation, thus the structure for electricity conduction is separated from the structure for heat dissipation.
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