Method for checking the quality of a wedge bond
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United States of America Patent
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Jul 25, 2006
Grant Date -
Dec 23, 2004
app pub date -
Jun 8, 2004
filing date -
Jun 18, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps: Placing the capillary at a side of the wire loop and next to the wedge bond, whereby the tip of the capillary is located below the level of the wire loop. Moving the capillary parallel to the surface of the substrate and orthogonally to the wire loop until the wedge bond tears away from the connection point or the wire breaks, and simultaneously measuring a signal that is a measure for a force exerted by the capillary on the wire loop, and Determining the maximum of the measured signal.
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