Wiring board sheet and its manufacturing method, multilayer board and its manufacturing method
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United States of America Patent
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Jul 25, 2006
Grant Date -
Jun 2, 2005
app pub date -
Oct 28, 2002
filing date -
Oct 26, 2001
priority date (Note) -
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Abstract
A wiring board sheet which enables the miniaturization of a wiring board by mounting electric components (10) in an insulation layer (4) to increase the quantity of mounting electric components, has a high reliability, and undergoes a complicated manufacturing process, and a method for manufacturing the wiring board sheet A multilayer board which is mannufactured from this wiring board sheet, eliminates a difference in thermal histories during molding in each layer, simplifies the manufacturing process, and realize miniaturization by the scale-down and high-density of a conductor circuit and an improvement in reliability, and a method for manufacturing the multilayer board.
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