Electroplating tool and method for selective plating
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United States of America Patent
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-
Jul 4, 2006
Grant Date -
Aug 18, 2005
app pub date -
Feb 16, 2004
filing date -
Feb 16, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements. Each of the holes is configured to receive a piece that is to be electroplated, and to mask a portion of the surface and expose another portion of the surface of the piece. The first and second plates are held together, and a mechanism is provided for shifting one of the plates with respect to the other between a first orientation in which the retaining elements are disengaged from pieces received in the holes and a second orientation in which the retaining elements are engaged with pieces received in the holes. This arrangement allows the pieces to be quickly and easily retained for an electroplating operation and released after the electroplating operation.
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