Water-cooling heat dissipation system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7069737
APP PUB NO 20050230086A1
SERIAL NO

10827277

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A water-cooling heat dissipation system includes a heat sink mounted on a heat generating electronic device and a circulating loop connected to two ends of the heat sink. The circulating loop has a water pump attached at the inlet of the heat sink, a first cooling base attached at the outlet of the heat sink, and a second cooling base between the water pump and the heat sink. The second cooling base has a cryogenic chip to provide icy water to the heat sink, such that heat dissipation efficiency is greatly enhanced.

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Patent Owner(s)

Patent OwnerAddress
WAFFER TECHNOLOGY CORPNO 2 TA-CHIH RD TAOYUAN CITY 330 R O C
WANG JACKNO 2 TA-CHIH RD TAOYUAN CITY 330 R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Cheng-Hua Taoyuan, TW 11 132
Lin, Michael Taoyuan, TW 104 2099
Ma, Charles Taoyuan, TW 22 253
Wang, Jack Taoyuan City 330, TW 74 1028

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