Method for aligning the bondhead of a Die Bonder
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United States of America Patent
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Jun 27, 2006
Grant Date -
Mar 24, 2005
app pub date -
Sep 10, 2004
filing date -
Sep 22, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.
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