Integrated optical chip
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United States of America Patent
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Jun 13, 2006
Grant Date -
Mar 25, 2004
app pub date -
Sep 19, 2003
filing date -
Sep 20, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An integrated optical chip has a crystalline structure cut along parallel principal crystallographic planes and a thickness of less than 1.0 mm. An optical signal pathway is disposed generally longitudinally in one of the cut surfaces of the chip, and the chip is attached to a substrate material up to 1.0 mm thick and having similar coefficients of thermal expansion in that principal crystallographic plane. A grounding plane is disposed between the chip and substrate to provide an electrically conductive path between opposite lateral surfaces of the chip. A method of making the chip is also described.
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