Microkeratome blade with arbitrary blade angle
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United States of America Patent
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Jun 13, 2006
Grant Date -
Sep 23, 2004
app pub date -
May 7, 2003
filing date -
Mar 17, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A cutting blade (56) having a cutting edge (80) defined by an intersection of a first cutting edge surface (72) and a second cutting edge surface (66) is disclosed. The angle between the first cutting edge surface (72) and the second cutting edge surface (66) defines a blade angle (.theta.). The blade (56) may be fabricated from a wafer (130) by an anisotropic etch. An upper surface (134) of the wafer (130) is defined by a first set of 3 Miller indices, where at least one individual Miller index of this first set has an absolute value greater than 3. A top surface (60) of the blade (56) is defined by part of the upper surface (134) of the wafer (130). The anisotropic etch proceeds until reaching a particular crystallographic plane to define the first cutting edge surface (72). Having the top surface (60) of the blade (56) defined by the noted set of 3 Miller indices increases the potential that a blade angle (.theta.) of a desired magnitude may be realized.
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