Compacted polishing pads for improved chemical mechanical polishing longevity
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United States of America Patent
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Jun 13, 2006
Grant Date -
N/A
app pub date -
Apr 20, 2005
filing date -
Nov 29, 2000
priority date (Note) -
Expired
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Abstract
The present invention is directed, in general, to a chemical mechanical polishing pad comprising a polishing body and a backing material coupled to the polishing body. The polishing body comprising a compacted thermoplastic foam substrate, wherein the compacted thermoplastic foam substrate has a density that is as at least about 1.1 times greater than an uncompacted thermoplastic foam substrate density. Other aspects of the invention comprise a method for manufacturing the above-described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad.
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