Electronic device manufacture
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United States of America Patent
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Jun 6, 2006
Issued Date -
N/A
app pub date -
Dec 19, 2003
filing date -
Dec 20, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing electronic devices containing one or more layers of materials that are sensitive to the strong chemicals used to remove cross-linked polymeric layers such as photoresists and antireflective coatings is provided. The cross-linked polymeric layers can be easily removed following etching through the use of certain removable layers disposed between the substrate and the cross-linked polymeric layers.
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