Wafer polisher
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United States of America Patent
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Jun 6, 2006
Issued Date -
N/A
app pub date -
Dec 4, 2001
filing date -
Dec 4, 2000
priority date (Note) -
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Abstract
A wafer polisher, wherein a retainer ring (28) is installed in a wafer holding head (14), a protective sheet material (52) is disposed inside the retainer ring (28), and a wafer (W) is pressed against a polishing pad (20) through the protective sheet material (52) for polishing, whereby the protective sheet material (52) can be disposed without causing wrinkles on the inner peripheral part of the retainer ring (28).
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