Automatic accurate alignment method for a semiconductor wafer cutting apparatus
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United States of America Patent
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May 30, 2006
Grant Date -
May 13, 2004
app pub date -
Nov 13, 2002
filing date -
Nov 13, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An automatic accurate alignment method for a wafer cutting apparatus includes: (a) placing a wafer on a platform, and moving the platform and a camera unit to initial positions; (b) matching the electrical output of the camera unit with a key pattern to find a plurality of adjacent working patterns, and recording center point coordinates of the working patterns; (c) calculating at least one distance value associated with the center point coordinates of a corresponding adjacent pair of the working patterns; (d) determining whether any one calculated distance value complies with a key pattern dimension; and (e) upon determination that there is one calculated distance value that complies with the key pattern dimension, rotating the platform so that an imaginary line interconnecting the center point coordinates that are associated with the determined distance value is disposed parallel to a predetermined wafer cutting direction.
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