Systems and slurries for chemical mechanical polishing
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United States of America Patent
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May 30, 2006
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N/A
app pub date -
Jan 19, 2005
filing date -
Jan 19, 2005
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Abstract
Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface.
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