Die assembly for molding optical disc substrates
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United States of America Patent
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May 30, 2006
Grant Date -
Sep 22, 2005
app pub date -
Dec 29, 2004
filing date -
Mar 18, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
It is an object of the present invention to provide a die assembly for molding optical disc substrates, wherein formation of a burr perpendicular to a reading surface that is opposite to a signal surface of each optical disc substrate can be prevented and two signal surfaces can be bonded together satisfactorily. To that end, in a die assembly for molding optical disc substrates that comprises an outer circumferential stamper holder 25 having: a stamper holding portion 34 that holds an outer circumferential edge portion 26E of a stamper 26 disposed on a specular plate 24; and an inner circumferential portion 33 that defines an outer circumferential end 27E of a molding cavity 27, the inner circumferential portion 33 of the outer circumferential stamper holder is provided with a projecting portion 35 having an acute cross-section that consists of a smooth surface projecting into the molding cavity 27 toward the stamper holding portion 34.
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