Apparatus and method for cleaning surfaces of semiconductor wafers using ozone
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United States of America Patent
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May 30, 2006
Grant Date -
Apr 29, 2004
app pub date -
Oct 29, 2002
filing date -
Oct 29, 2002
priority date (Note) -
Expired
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Abstract
An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.
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