Multi-chip semiconductor package with integral shield and antenna
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United States of America Patent
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May 23, 2006
Issued Date -
N/A
app pub date -
Jul 16, 2003
filing date -
May 14, 2001
priority date (Note) -
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Abstract
A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
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