Packaging structure and process of electronic card
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United States of America Patent
Stats
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May 23, 2006
Grant Date -
Aug 11, 2005
app pub date -
Sep 17, 2004
filing date -
Feb 6, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.
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