Multilayer structure based on polyamides and on a tie layer made of a copolyamide blend
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United States of America Patent
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May 23, 2006
Grant Date -
May 26, 2005
app pub date -
Nov 2, 2004
filing date -
Jan 29, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multilayer structure based on polyamides, comprising: a first layer (1) formed from a polyamide P.sub.1 or from a blend of a polyamide P.sub.1 and a polyolefin PO.sub.1 having a P.sub.1 polyamide matrix, optionally, a layer (2a) formed from EVOH; a layer (2) formed from a blend of PA-6/12 copolyamides, one comprising by weight more 6 than 12 and the other more 12 than 6; a layer (3) formed from a polyamide P.sub.3, it being possible for P.sub.1 and P.sub.3 to be identical or different, the layers (1), (2), (2a) and (3) being successive and adhering to one another in their respective contact regions.
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