Method of making circuitized substrate assembly
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United States of America Patent
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May 23, 2006
Issued Date -
N/A
app pub date -
Mar 30, 2004
filing date -
Dec 19, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuitized substrate assembly and method for making same wherein the assembly includes individual circuitized substrates bonded together. The substrates each include at least one opening, only one of which is substantially filled with a conductive paste prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.
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