Selectively bonded thin film layer and substrate layer for processing of useful devices
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United States of America Patent
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May 16, 2006
Grant Date -
Nov 21, 2002
app pub date -
Sep 12, 2001
filing date -
May 18, 2001
priority date (Note) -
Expired
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Abstract
A layered structure generally includes a first layer suitable for having a useful element formed therein or thereon selectively attached or bonded to a second layer. A method to form a layered structure generally comprises selectively adhering a first substrate to a second substrate.
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