Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus
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United States of America Patent
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May 16, 2006
Grant Date -
Sep 9, 2004
app pub date -
Dec 23, 2003
filing date -
Dec 24, 2002
priority date (Note) -
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Abstract
A method is provided for manufacturing a semiconductor device, a semiconductor device, a circuit board, and an electronic apparatus. In such a semiconductor device, semiconductor chips can be readily aligned when they are stacked and terminals can be prevented from being short-circuited, thereby enhancing the reliability of the connection between electrodes of the semiconductor chips. According to the method, semiconductor chips are perforated, and a conductive material such as copper is filled into each perforation, thereby forming a terminal that contains the conductive material and has a recessed portion, disposed in the upper face thereof.
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