Mold material processing device, method and apparatus for producing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 16, 2006
Grant Date -
Jan 22, 2004
app pub date -
May 25, 2001
filing date -
May 24, 2000
priority date (Note) -
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Abstract
The invention relates to a molten material processing device having an elongated thermal element like a heating element, a thermocouple, a sensor, a heatpipe and a cooling pipe which is characterised in that said elongated thermal element (2) is located in a recess (3) provided in a surface (6) of the molten material processing device (1), the recess (3), comprising a first portion (4) and a second portion (5), has a cross-section which is larger than a cross-section of the thermal element (2), so as to provide a clear space (7) between the thermal element (2) and the surface (6) of the processing device (1), the clear space (7) which is limited by the first portion (4) and the thermal element (2) is filled by a thermally sprayed material (8) and the second portion (5), which is adapted to the cross-section of the thermal element (2), partially surrounds and directly contacts same.
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