Thermoplastic structures for the storing and transporting of organoleptic sensitive products

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United States of America Patent

PATENT NO 7041352
SERIAL NO

10611007

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Abstract

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The present invention relates to thermoplastic structures wherein the inner sealant layer of said structure comprises a polyethylene having a density from about 0.88 to about 0.96 and wherein the polyethylene is processed at a temperature ranging from about 150.degree. F. to about 500.degree. F. in order to prevent the release of extractable materials. The thermoplastic structures can be used independently to form a flexible packaging film or can be affixed to a second film structure or substrate to form a flexible packaging film. The flexible packaging films can be used for forming containers for the storing and transporting of organoleptic sensitive products.

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Patent Owner(s)

Patent OwnerAddress
BEMIS COMPANY INC134 E WISCONSIN AVENUE ONE NEENAH CENTER 4TH FLOOR NEENAH WI 54956

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barber, Victor Jason Kaukauna, WI 2 17
Siu, Roberto Neenah, WI 15 59

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