Localized heating and cooling of substrates
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United States of America Patent
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May 2, 2006
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N/A
app pub date -
Mar 17, 2000
filing date -
Mar 17, 2000
priority date (Note) -
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Abstract
The present invention is directed to an apparatus and process for locally heating and/or cooling of semiconductor wafers in thermal processing chambers. In particular, the apparatus of the present invention includes a device for heating or cooling localized regions of a wafer to control the temperature of such regions during one or more stages of a heat cycle. In one embodiment, gas nozzles eject gas towards the bottom of the wafer to provide localized temperature control. In another embodiment, a transparent gas pipe containing a variety of gas outlets distributes gas onto the top surface of the wafer to provide localized temperature control.
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