Copper foil for printed-wiring board
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United States of America Patent
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May 2, 2006
Grant Date -
Nov 18, 2004
app pub date -
May 7, 2004
filing date -
May 13, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
It is an object of the present invention to provide a surface-treated copper foil wherein a surface layer which is situated on a side being not bonded to a resin in a copper foil for a printed-wiring board and on which a copper direct drilling process by carbon dioxide laser is easily applied is prepared with a small amount of a covering material in accordance with a simple manner.In the copper foil used for a direct drilling process by laser of the present invention, 50 to 1000 mg/m.sup.2 of a covering layer consisting of iron and tin, or a covering layer made of an alloy prepared from iron, tin, and at least one member selected from the group consisting of nickel, cobalt, zinc, chromium, and phosphorous is provided on at least one side of the copper foil.
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