Epitaxial thin films

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United States of America Patent

PATENT NO 7033637
SERIAL NO

09889237

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Abstract

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Epitatial thin films for use as buffer layers for high temperature superconductors, electrolytes in solid oxide fuel cells (SOFC), gas separation membranes or dielectric material in electronic devices, are disclosed. By using CCVD, CACVD or any other suitable deposition process, epitaxial films having pore-free, ideal grain boundaries, and dense structure can be formed. Several different types of materials are disclosed for use as buffer layers in high temperature superconductors. In addition, the use of epitaxial thin films for electrolytes and electrode formation in SOFCs results in densification for pore-free and ideal gain boundary/interface microstructure. Gas separation membranes for the production of oxygen and hydrogen are also disclosed. These semipermeable membranes are formed by high-quality, dense, gas-tight, pinhole free sub-micro scale layers of mixed-conducting oxides on porous ceramic substrates. Epitaxial thin films as dielectric material in capacitors are also taught herein. Capacitors are utilized according to their capacitance values which are dependent on their physical structure and dielectric permittivity. The epitaxial thin films of the current invention form low-loss dielectric layers with extremely high permittivity. This high permittivity allows for the formation of capacitors that can have their capacitance adjusted by applying a DC bias between their electrodes.

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Patent Owner(s)

Patent OwnerAddress
DAE SANG CORPORATION52-1 KAYANG-DONG KANGSEO-KU SEOUL 157-200
KANG YONG HOAPPLIED MICROBIOLOGY DEPARTMENT YONGNAM UNIVERSITY 712-749 DAE-DONG KYONGSAN-CITY JYONGSANGBUK-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Deshpande, Girish Atlanta, GA 8 167
Hunt, Andrew Tye Atlanta, GA 26 503
Jan, Tzyy-Jiuan Alpharetta, GA 1 8
Lin, Wen-Yi Ellington, CT 81 1412

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