Thin film dielectrics for capacitors and methods of making thereof
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United States of America Patent
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Apr 18, 2006
Grant Date -
Jan 20, 2005
app pub date -
Jul 17, 2003
filing date -
Jul 17, 2003
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Abstract
Dielectrics are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties. The dielectrics are annealed at temperatures allowing the use of copper foil substrates, and at low oxygen partial pressures.
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