Buffered-layer memory cell

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United States of America Patent

PATENT NO 7029924
SERIAL NO

10755654

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Abstract

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A method is provided for forming a buffered-layer memory cell. The method comprises: forming a bottom electrode; forming a colossal magnetoresistance (CMR) memory film overlying the bottom electrode; forming a memory-stable semiconductor buffer layer, typically a metal oxide, overlying the memory film; and, forming a top electrode overlying the semiconductor buffer layer. In some aspects of the method the semiconductor buffer layer is formed from YBa2Cu3O7-X (YBCO), indium oxide (In2O3), or ruthenium oxide (RuO2), having a thickness in the range of 10 to 200 nanometers (nm). The top and bottom electrodes may be TiN/Ti, Pt/TiN/Ti, In/TiN/Ti, PtRhOx compounds, or PtIrOx compounds. The CMR memory film may be a Pr1-XCaXMnO3 (PCMO) memory film, where x is in the region between 0.1 and 0.6, with a thickness in the range of 10 to 200 nm.

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Patent Owner(s)

Patent OwnerAddress
XENOGENIC DEVELOPMENT LIMITED LIABILITY COMPANY2711 CENTERVILLE RD SUITE 400 WILMINGTON DE 19808

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Evans, David R Beaverton, OR 96 2356
Hsu, Sheng Teng Camas, WA 411 11449
Li, Tingkai Vancouver, WA 123 2598
Pan, Wei Vancouver, WA 172 1920
Tajiri, Masayuki Vancouver, WA 18 339
Zhang, Fengyan Vancouver, WA 98 1826
Zhuang, Wei-Wei Vancouver, WA 95 2922

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