Device for fitting a substrate with a flip chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 18, 2006
Grant Date -
N/A
app pub date -
Mar 1, 2000
filing date -
Mar 5, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A freely positionable placement head (1) removes presented flip chips (6) from a wafer (5), the connection side of said chips being directed upward. The placement head has a turning device (9), in which, by the time they are placed onto a substrate (8) to be provided with placed components, the flip chips are turned in such a way that they can be placed with their connection side onto the substrate. This makes it possible to dispense with a complex turning device assigned to the wafer (5).
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