Microstructures comprising a dielectric layer and a thin conductive layer

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United States of America Patent

PATENT NO 7026697
APP PUB NO 20040164423A1
SERIAL NO

10790339

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Abstract

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Surface micromachined structures having a relatively thick dielectric layer and a relatively thin conductive layer bonded together.

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Patent Owner(s)

Patent OwnerAddress
CUBIC CORPORATION9333 BALBOA AVENUE SAN DIEGO CA 92123

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sherrer, David W Blacksburg, VA 107 4596

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