Microstructures comprising a dielectric layer and a thin conductive layer
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United States of America Patent
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Apr 11, 2006
Grant Date -
Aug 26, 2004
app pub date -
Mar 1, 2004
filing date -
Mar 31, 2000
priority date (Note) -
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Abstract
Surface micromachined structures having a relatively thick dielectric layer and a relatively thin conductive layer bonded together.
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