Information handling system
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United States of America Patent
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Apr 4, 2006
Grant Date -
Aug 5, 2004
app pub date -
Mar 24, 2003
filing date -
Jan 30, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An information handling system, e.g., computer, server or mainframe, which includes a multi-chip electronic package utilizing an organic, laminate chip carrier and a plurality of semiconductor chips positioned on an upper surface of the carrier. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric layers and couples the chips to underlying conductors on the bottom surface thereof. The carrier may include a high-speed portion to assure high-frequency connection between the semiconductor chips and may also include an internal capacitor and/or thermally conductive member for enhanced operational capabilities of the final system product.
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