Probe pins zero-point detecting method, and prober
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United States of America Patent
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Apr 4, 2006
Issued Date -
N/A
app pub date -
Oct 20, 2004
filing date -
Feb 20, 2003
priority date (Note) -
Expired
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Abstract
A zero-point detecting method of this invention is performed prior to testing the electrical characteristics of a wafer by bringing an object to be tested on a stage and probes of a probe card into contact with each other. The surface of a zero-point detection plate is made of a conductive material (e.g., copper). The zero-point detection plate is used to detect a zero point as a position where the surface of the object to be tested comes into contact with the probe pins.
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