Apparatus for placing a semiconductor chip as a flipchip on a substrate
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United States of America Patent
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-
Apr 4, 2006
Grant Date -
Nov 7, 2002
app pub date -
Feb 28, 2002
filing date -
May 7, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.
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