Heat dissipating device having improved fastening structure
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United States of America Patent
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Mar 28, 2006
Grant Date -
May 26, 2005
app pub date -
Nov 21, 2003
filing date -
Nov 21, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.
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