Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems
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United States of America Patent
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Mar 28, 2006
Grant Date -
Aug 19, 2004
app pub date -
Dec 10, 2003
filing date -
Dec 12, 2002
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Expired
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Abstract
Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images. The non-photosensitive polyimide precursor compositions comprise a) one or more polyamic acids soluble in gamma-butyrolactone (GBL) and aqueous tetramethyl ammonium hydroxide, and with the proviso that the polyamic acid is also resistant to a solvent used in a photosensitive composition with which the polyimide precursor composition is to be used; b) a solvent comprising gamma-butyrolactone; and c) one or more adhesion promoters selected from structures described by Formulae I-VI ##STR1##
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